Wire/Cable Type
Discrete Wire
Mating Pin Diameter Range
.034 to .041 in
Contact Spring Plating Thickness
30 µin
Connector System
Cable-to-Board
Contact Mating Area Plating Thickness
30 µin
Spring Material
Beryllium Copper
Sleeve Plating Material
Tin
Circuit Application
Power u0026 Signal
Operating Temperature Range
-65 to 125 °C
Contact Spring Plating Material
Gold
Hole Size (Recommended)
.072 in
Sleeve Style
Closed Bottom
Termination Method to Printed Circuit Board
Through Hole - Press-Fit
Contact Base Material
Beryllium Copper
Wire/Cable Size
20 to 18 AWG
Connector u0026 Contact Terminates To
Printed Circuit Board
Termination Method to Wire u0026 Cable
Solder
Contact Current Rating (Max)
7.5 A
PCB Thickness (Recommended)
.031 to .125 in
Contact Transmits (Typical)
Signal (Data)/Power
Insertion Method
Hand/Semi-Automatic
Country of Origin (subject to change)
United States
