| Item | Silicone-Free Heat Sink Compound |
| Application | In Electronics, Heat Sink Compound is Used to Thermally Bond a Component and a Mechanical Heat Sink, Efficient Cooling |
| Size | 4 oz |
| Container Size | 4 oz. |
| NSF Rating | Not Rated |
| Country of Origin (subject to change) | United States |
| Package Quantity | 1 |
Silicone-Free Heat Sink Compound, TECHSPRAY, Mfr# 1978-DP
$33.32
Free shipping will be applied on orders over $50
Silicone-Free Heat Sink Compound, Size 4 oz
9999 in stock
Must order in multiples of 1
Subtotal:
$33.32
You must be logged in to post a review.
Reviews
There are no reviews yet.