| Property | Value |
|---|---|
| Item | Silicone-Free Heat Sink Compound |
| Application | In Electronics, Heat Sink Compound is Used to Thermally Bond a Component and a Mechanical Heat Sink, Efficient Cooling |
| Size | 4 oz |
| Container Size | 4 oz. |
| NSF Rating | Not Rated |
| Country of Origin (subject to change) | United States |
| Package Quantity | 1 |
Silicone-Free Heat Sink Compound, Techspray, Mfr#: 1978-DP
$35.15
Free shipping will be applied on orders over $50
Silicone-Free Heat Sink Compound, Size 4 oz
9999 in stock
Subtotal:
$35.15
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