Solder Wire, Form Flux-Cored Wire, Material Composition 99.3 Percent Tin, 0.6 Percent Copper, 0.05 Percent Nickel, Wire Diameter 1 mm, Weight 100 g, Melting Temperature (Minimum) 442 Degrees F, Melting Temperature (Maximum) 444 Degrees F, Flux Type No-Clean, Flux Classification ROM1, Solder Series SCN M1, For Joining Metal, Application High Soldering Temperature, Container Type Spool
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