Material - Plating Termination
Tin
Material - Metal
Copper-Nickel-Silicon
Material - Resin
High Temperature Thermoplastic
Max. Cycles at Max. Process Temperature
3
Material - Plating Mating
Gold
PCB Thickness - Recommended
2.40mm
Durability (mating cycles max)
50
Plating min - Termination
2.540µm
Process Temperature max. C
260
Pitch - Mating Interface
6.38mm
Termination Interface: Style
Through Hole
Plating min - Mating
0.762µm
Current - Maximum per Contact
160.0A
Surface Mount Compatible (SMC)
Yes
(p)ower-(s)ignal Configuration
4p - 0s
Duration at Max. Process Temperature (seconds)
40
Temperature Range - Operating
-40° to +105°C
Pitch - Termination Interface
3.00mm, 3.38mm
Country of Origin (subject to change)
Mexico
