Solder Wire, Form Flux-Cored Wire, Material Composition 96.5 Percent Tin, 3 Percent Silver, 0.5 Percent Copper, Wire Diameter 0.3 mm, Weight 21 g, Melting Temperature (Minimum) 422 Degrees F, Melting Temperature (Maximum) 430 Degrees F, Flux Type No-Clean, Flux Classification ROM1, Solder Series SAC M1, For Joining Metal, Application High-Soldering Temperature, Container Type Spool
✓ In stock
No reviews yet. Be the first to share your experience!