Item | Solder Wire |
Application | High-Soldering Temperature |
Standards | RoHS Compliant |
Container Type | Spool |
Diameter | 0.3 mm |
Composition | 96.5% Tin, 3% Silver, 0.5% Copper |
Flux Requirement | Contains Flux Core |
Flux Classification | ROM1 |
Material Composition | 96.5% Tin, 3% Silver, 0.5% Copper |
For Joining | Metal |
Wire Diameter | 0.3 mm |
Dimensions | 0.3 mm x 21 g |
Features | Excellent Melting Characteristics, Reduced Fe Leaching to Increase Tip Life Time and Reduce Tip Consumption by upto 70%, Reduced Splash of Flux and No-Clean Flux, Very Fast Wetting Even on Difficult Surfaces, as Dirty and Oxidized Materials |
Melting Temperature (Minimum) | 422 Degrees F |
Soldering Temperature Range | 422 Degrees F to 430 Degrees F |
Solder Series | SAC M1 |
Weight | 21 g |
Minimum Soldering Temperature | 422 Degrees F |
Melting Temperature (Maximum) | 430 Degrees F |
Flux Type | No-Clean |
Maximum Soldering Temperature | 430 Degrees F |
Solder Composition | Tin-Copper-Silver |
Form | Flux-Cored Wire |
Country of Origin (subject to change) | Japan |
Package Quantity | 1 |
Solder Wire, WELLER, Mfr# T0051402499
$29,95
Free shipping will be applied on orders over $50
Solder Wire, Form Flux-Cored Wire, Material Composition 96.5 Percent Tin, 3 Percent Silver, 0.5 Percent Copper, Wire Diameter 0.3 mm, Weight 21 g, Melting Temperature (Minimum) 422 Degrees F, Melting Temperature (Maximum) 430 Degrees F, Flux Type No-Clean, Flux Classification ROM1, Solder Series SAC M1, For Joining Metal, Application High-Soldering Temperature, Container Type Spool
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