| Item | Solder Wire |
| Application | High Soldering Temperature |
| Standards | RoHS Compliant |
| Container Type | Spool |
| Solder Series | SCN M1 |
| Features | Higher Strength Due to Nickel Compared to Other Silver-Free Alloys, Reduced Fe Leaching to Increase Tip Life Time and Reduce Tip Consumption by upto 70%, Reduced Splash of Flux and No-Clean Flux, Solder Joint Shines (Perfect Optics), Very Fast Wetting Even on Difficult Surfaces, as Dirty and Oxidized Materials |
| Composition | 99.3% Tin, 0.6% Copper, 0.05% Nickel |
| Flux Requirement | Contains Flux Core |
| Wire Diameter | 1 mm |
| Flux Classification | ROM1 |
| Diameter | 1 mm |
| Solder Composition | Tin-Copper-Nickel |
| Minimum Soldering Temperature | 442 Degrees F |
| Material Composition | 99.3% Tin, 0.6% Copper, 0.05% Nickel |
| Melting Temperature (Maximum) | 444 Degrees F |
| Maximum Soldering Temperature | 444 Degrees F |
| For Joining | Metal |
| Dimensions | 1 mm x 100 g |
| Melting Temperature (Minimum) | 442 Degrees F |
| Soldering Temperature Range | 442 Degrees F to 444 Degrees F |
| Form | Flux-Cored Wire |
| Weight | 100 g |
| Flux Type | No-Clean |
| Country of Origin (subject to change) | Japan |
| Package Quantity | 1 |
Solder Wire, WELLER, Mfr# T0051404699
$17,85
Free shipping will be applied on orders over $50
Solder Wire, Form Flux-Cored Wire, Material Composition 99.3 Percent Tin, 0.6 Percent Copper, 0.05 Percent Nickel, Wire Diameter 1 mm, Weight 100 g, Melting Temperature (Minimum) 442 Degrees F, Melting Temperature (Maximum) 444 Degrees F, Flux Type No-Clean, Flux Classification ROM1, Solder Series SCN M1, For Joining Metal, Application High Soldering Temperature, Container Type Spool
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