| Item | Solder Wire |
| Application | High-Soldering Temperature |
| Standards | RoHS Compliant |
| Features | Higher Strength Due to Nickel Compared to Other Silver-Free Alloys, Reduced Fe Leaching to Increase Tip Life Time and Reduce Tip Consumption by upto 70%, Reduced Splash of Flux and No-Clean Flux, Solder Joint Shines (perfect Optics), Very Fast Wetting Even on Difficult Surfaces, as Dirty and Oxidized Materials |
| Container Type | Spool |
| Material Composition | 99.3% Tin, 0.6% Copper, 0.05% Nickel |
| Diameter | 0.5 mm |
| Flux Requirement | Contains Flux Core |
| Flux Type | No-Clean |
| Solder Series | SCN M1 |
| Melting Temperature (Minimum) | 442 Degrees F |
| Minimum Soldering Temperature | 442 Degrees F |
| Melting Temperature (Maximum) | 444 Degrees F |
| Flux Classification | ROM1 |
| Form | Flux-Cored Wire |
| Dimensions | 0.5 mm x 100 g |
| Maximum Soldering Temperature | 444 Degrees F |
| Wire Diameter | 0.5 mm |
| Weight | 100 g |
| For Joining | Metal |
| Soldering Temperature Range | 442 Degrees F to 444 Degrees F |
| Solder Composition | Tin-Copper-Nickel |
| Composition | 99.3% Tin, 0.6% Copper, 0.05% Nickel |
| Country of Origin (subject to change) | Japan |
| Package Quantity | 1 |
Solder Wire, WELLER, Mfr# T0051404799
$20,15
Free shipping will be applied on orders over $50
Solder Wire, Form Flux-Cored Wire, Material Composition 99.3 Percent Tin, 0.6 Percent Copper, 0.05 Percent Nickel, Wire Diameter 0.5 mm, Weight 100 g, Melting Temperature (Minimum) 442 Degrees F, Melting Temperature (Maximum) 444 Degrees F, Flux Type No-Clean, Flux Classification ROM1, Solder Series SCN M1, For Joining Metal, Application High-Soldering Temperature, Container Type Spool
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